Thin Film Technology for Ceramic, Glass & Polymer Applications

Wire-bonding pads, low-capacitance stand-offs and DC-bias connections for hybrid assembly.

Uniform NiCr and TaN resistors, laser trimmed for highly accurate resistance values.

High-k single-layer and array capacitors for microwave circuits, DC blocking and RF bypass.

Low-loss, precise thin-film filters developed for 5G and 28 GHz applications.

Low-loss transmission lines with stable performance across the 0–20 GHz range.

Compact microwave circuits designed around customer frequency and power requirements.

Fine-line coupled structures with controlled geometry and repeatable electrical performance.

Thin-film resistors, conductors and multilayer features integrated to customer drawings.

Thermally stable substrates for spotlights and high-current LED applications.

High-insulation boards for converters, controllers and high-power transistor arrays.

Reliable ceramic platforms for electric vehicles, motors and solar-cell applications.

Alumina or aluminum-nitride submounts, optionally supplied with Au-Sn eutectic solder.

ITO-panel test kits for OLED process verification and material development.

Glass and quartz windows for photodiodes, laser diodes, LEDs and UV-C applications.